Thermal Interface Materials
Trumonytechs thermal interface materials
Trumonytechs provides thermal interface materials with robust thermal conductivity and sealing. These products offer bonding for semiconductors, electronics, automotive, and communications industries.
Thermal interface materials are used to improve the thermal conductivity of heat-generating electronic components. They are generally placed between heat-conducting electronic components and heat-dissipating parts. It is a silicone resin with a certain percentage of metal oxides to give it high thermal conductivity, mechanical strength, and flexibility. It can fill the micro gap between the contact surfaces, expel air, and reduce the thermal resistance of the entire heat transfer path. Trumonytechs’ thermal interface materials can effectively work in extreme environments. They reduce the operating temperature of heat dissipation components, extending their service life.
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The working principle of thermal interface materials
Trumonytechs thermal conductive interface materials consist of four main components. These are resins, cross-linking agents, additives, and thermal conductive fillers. The rational combination of these four materials can greatly improve the mechanical properties and thermal conductivity of the electronic components. This allows the electronic components to operate in an excellent working environment.
Resin is the material’s matrix. Its main purpose is to provide strength, flexibility, and compressibility for electronic components.
In the composition, we also add a cross-linking agent. Its main purpose is to cure the matrix (resin component) and transform the liquid resin into a solid elastomer.
The resin composition itself does not meet the thermal conductivity requirements needed for electronic components, which are generally ≤ 0.2 W/m*K. To improve the thermal conductivity, Tronytechs’ R&D team has added thermal conductive fillers to the solid resin.
Thermal conductive fillers mainly consist of metal oxides. By reasonably matching metal oxide powders of different particle sizes, they form good thermal conductivity pathways in the base resin. They thus obtain thermal conductivity tens to hundreds of times higher than that of the resin itself.
This way, the resin material can fully meet the thermal conductivity requirements of electronic original parts.
Finally, catalytic additives enhance the reaction rate of the thermal conductive filler and resin material.
Trumonytechs‘ metal oxide filler blends are the most common interface materials. If you have more demanding thermal conductivity needs, we can also select a higher thermal conductivity filler to meet your specific requirements.
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How to choose thermal interface materials?
Silicon substrates have high-temperature resistance and low hardness. This makes them the most widely used type of substrate at present. However, the only drawback is the presence of silicone oil precipitation. This prevents it from being used in precision instruments such as cameras, optical instruments, and hard disk drives.
Trumonytechs has developed and produced silicone-free substrates to address this issue.
So, when selecting a substrate, please let us know your specific application. We provide you with customized material solutions.
We will select the thermal interface material with the thermal conductivity you need. We’ll do this according to the application environment and usage requirements.
First, we determine the heating of the power components. Then, we determine the gap thickness, heat transfer area, and target temperature for the design.
On this basis, we will use the Fourier equation to estimate the area thermal resistance. Then we will determine the required product according to the thickness thermal resistance curve of different thermal pads.
Trumonytechs’ R&D team has complete expertise. You just need to tell your specific requirements. We help you determine what you need.
Select the best thermal conductive material to improve its performance. Choose based on application and material property requirements.
Trumonytechs develops and manufactures different material types. Examples include thermal pads, thermal gel, thermal grease, and thermal conductive structural adhesives. They are tailored for specific applications.
Material compatibility is one of the most overlooked factors. In extreme environments, interface materials can be severely affected, affecting component life.
For example, exposing to silicon vapor can easily damage the substrate. This means that you must choose a silicone TIM. Therefore, when selecting materials, you must inform us of the detailed application environment.
Common Application of TIM
Trumonytechs provides professional thermal solutions for many industries. The thermal interface material is the most important for thermal conduction. The main function is to fill the gap between the two contact interfaces. It also acts as a thermal interface and improves heat dissipation performance. Common industries are:
Thermal conductive interface materials are used between aluminium substrates and heat sink fins, between aluminium substrates and lamp housings.
between computer graphics cards and heat sinks, between cooling devices and chassis or frames.
potting of solar photovoltaic inverters; between battery packs and water-cooled versions; interface between MOS tubes, transformers and heat sinks or housings.
Thermal conduction between motherboard ICs and heatsinks or housings for TD-CDMA products; thermal conduction between DC-DC ICs and housings for set-top boxes
Trumonytechs offers a complete range of battery pack solutions. These include square and cylindrical battery packs.
applications in automotive electronics (e.g. xenon lamp ballasts, audio, screens, radar lamp car series products)
Advantages of Trumonytechs Thermal Interface Materials
Trumonytechs mainly develops and manufactures silicone thermal conductive materials. They also produce auxiliary polyurethane and epoxy resin systems. Highly thermal stability and resistance to other harsh environments. And Trumonytechs also has a complete interface material research and development team. We rely on the scientific research team of Shanghai Jiaotong University. They continuously explore and improve thermal interface materials. Aims to provide professional thermal interface materials to global customers. A complete portfolio of packaging and Assembly material for various industries.