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Best Materials for Dissipating Heat in Electronics

With the rapid development of materials technology, electronic components of high frequency, high speed and integrated circuit technology has also broken through. While the size of electronic components has decreased, the total power density has increased dramatically, and the heat flow density has increased rapidly. The high temperature environment will affect the performance of electronic components, which requires effective thermal control of electronic components.

In smartphones, for example, as the main frequency of the smartphone chip is getting higher and higher and the heat generated, not only affects the customer’s feeling of use, but also damages the cell phone hardware. 2019 onwards, cell phone heat dissipation has become the new focus of the market, such as Xiaomi cell phone’s Black Shark cell phone, it is equipped with multi-stage direct touch integrated thermal cooling system, which uses heat dissipation components mainly copper sheet with a small amount of built-in liquid in the middle slender sector.

Best Materials for Dissipating Heat in Electronics-trumonytechs

General application of heat dissipation materials for electronic products

The role of heat dissipation of electronic components is mainly to effectively control the temperature of electronic devices to effectively improve the performance of electronic products. Involves a variety of different material properties.

The surface of the electronic material and the heat sink between the existence of a fine uneven gap, if they are installed directly together, the actual contact area between them is only 10% of the heat sink base area, the rest are air gaps. Because the air thermal conductivity of only 0.024W / (m.K), will lead to electronic components and heat sink between the contact thermal resistance is very large, seriously impede the conduction of heat, resulting in low performance of the heat sink.

The electronic material surface and heat sink with a fine gap between, if not handled and installed directly, its effective contact area is only 10% of the heat sink base area, the remaining space are air gaps. The extremely low thermal conductivity of air will lead to electronic components and thermal devices in contact with the thermal resistance is very large, preventing the conduction of heat, resulting in a very low performance of the heat sink parts.

The use of thermal conductive materials to fill the gap can significantly increase the contact area between the heat generating parts and the heat dissipating parts to achieve good heat dissipation, Trumonytechs, as an expert in thermal management solutions, can provide you with the following series of thermal conductive materials: thermal conductive silicone film, thermal conductive silicone grease, and thermal conductive potting adhesive, thermal conductive gel.

Comparison of several electronic heat dissipation materials

The next will focus on the introduction of thermal conductive silicone film, thermal conductive silicone grease and thermal conductive gel and thermal conductive potting adhesive.

Thermal conductive silicone film: silicone is the basic material, supplemented by the addition of metal oxides, and then synthesized through a special process of a thermally conductive media material. It is usually a soft, tearable sheet and can be cut into different sizes as needed.

Thermal conductive silicone grease: It is a thick viscous material made of silicone as the main raw material, supplemented with heat resistant and thermally conductive materials, and can be used for thermal conductivity contact of CPU and GPU components.

Thermal conductive gel: It is a semi-solid material, in the form of paste, well formed, non-flowing, low volatility, similar to Play-Doh. Compared with thermally conductive silicone grease, it has higher viscosity and usually does not need to be applied to the parts that need to dissipate heat, but can be filled directly into the gaps.

Thermal conductive potting adhesive: epoxy resin and filled thermally conductive powder as the main material, supplemented by hardener and accelerator, with very good thermal conductivity, high temperature stability and mechanical strength, with the function of thermal conductivity, potting, sealing and fixing.

In summary, these thermally conductive materials can be used for heat transfer and heat dissipation, but the physical properties and uses are different. How to choose which thermal conductive media is determined by the specific application requirements and equipment type.

How to choose the right electronic thermal products?

Thermal conductive silicone film is suitable for filling the gap between uneven or connectors, such as cell phones, flat panel electricity and small electronic devices such as laptops, etc. It can ensure stability and also resist vibration and shock while maintaining stability.

It has good stability, can maintain performance at very high temperature, and also has the characteristics of not easy to flow and evaporate, so it is suitable for filling irregular gaps and gaps between surfaces in larger electronic devices such as servers, industrial control machines, LED lights, etc.

Thermal conductive gel is suitable for fixing thermal components and filling uneven voids on surfaces because of its high viscosity and thermal conductivity. The material is more stable in high temperature environments and is suitable for heat dissipation of electronic devices in high temperature environments, such as power supplies and automotive electronics.

Thermal conductive potting adhesive is commonly used for potting electronic components to improve heat dissipation performance and mechanical protection performance. It has high thermal conductivity, heat resistance, sealing and mechanical strength, which can protect electronic components from environmental factors, and is suitable for power supply, battery, transformer, inductor and other electronic components for potting.

Therefore, how to choose thermal conductive materials, need to be based on the actual application requirements, heat dissipation power, the characteristics of the material and other comprehensive factors for comprehensive consideration.

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