Thermal Interface Materials

Trumonytechs thermal interface materials

Trumonytechs provides thermal interface materials with robust thermal conductivity, sealing, bonding for semiconductors, electronics, automotive, and communications industries

Thermal interface materials are used to improve the thermal conductivity of heat generating electronic components and are generally placed between heat conducting electronic components/heat dissipating parts.It is a silicone resin with a certain percentage of metal oxides to give it a high thermal conductivity, as well as a certain mechanical strength and flexibility. It can fill micro gap between the contact surfaces, expel air, reduce the thermal resistance of the entire heat transfer path. The thermal interface materials from Trumonytechs can effectively work even in extreme environments, effectively reducing the operating temperature of heat dissipation components and extending their service life.

Thermal interface material heat dissipation schematic - Tronytechs
Trumonytechs Laboratories - Thermal management specialists

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Thermal Management Materials

Our responsive team will provide thermal solutions and thermal management materials to meet your different demands of the performance, cost. (including potting glue, thermal conductive pad, thermal grease etc.)

Potting Glue
Potting Glue
Thermal Conductive Pad
Thermal Conductive Pad
Thermal Conductive Structural Adhesive
Thermal Conductive Structural Adhesive
Thermal Conductive Silicone Grease
Thermal Conductive Silicone Grease
Thermal Conductive Gel
Thermal Conductive Gel

The working principle of thermal interface materials

Trumonytechs thermal conductive interface materials consist of four main components: resins, Cross-linking agents, additives and thermal conductive fillers. The rational combination of these four materials can greatly improve the mechanical properties of the electronic components thermal conductivity, so that the electronic components can be operated in an excellent working environment.

Resin, as the matrix of the material ,whose main purpose is to provide strength, flexibility and compressibility for electronic components.

In the composition, we also add a cross-linking agent, the main purpose of which is to cure the matrix (that is, the resin component) to transform the liquid resin into a solid elastomer.

Since the thermal conductivity of the resin composition itself does not meet the thermal conductivity requirements needed for electronic components, which are generally ≤ 0.2 W/m*K, Tronytechs’ R&D team has added thermal conductive fillers to the solid resin in order to enhance the thermal conductivity of the interface material.

Thermal conductive fillers mainly consist of metal oxides. By reasonably matching metal oxide powders of different particle sizes, they form good thermal conductivity pathways in the base resin, thus obtaining thermal conductivity tens to hundreds of times higher than that of the resin itself.

In this way, the resin material can fully meet the thermal conductivity requirements of electronic original parts.

Finally, the reaction rate of the thermal conductive filler and resin material is then enhanced by catalytic additives.

Trumonytechs‘ metal oxide filler blends are the most common interface materials. If you have more demanding thermal conductivity needs, we can also select a higher thermal conductivity filler to meet your specific requirements.

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How to choose thermal interface materials?

Silicon substrates have high temperature resistance and low hardness, making them the most widely used type of substrate at present. However, the only drawback is the presence of silicone oil precipitation, which prevents it from being used in precision instruments such as cameras, optical instruments, and hard disk drives.

Trumonytechs has developed and produced silicone-free substrates to address this issue.

So, when selecting a substrate, please let us know your specific application. We provide you with customized material solutions.

We will select the thermal interface material with the thermal conductivity you need according to the application environment and usage requirements.

First, we determine the heating of the power components, then determine the gap thickness, heat transfer area, and target temperature for the design

On this basis, we will use the Fourier equation to estimate the area thermal resistance, and then determine the required product according to the thickness thermal resistance curve of different thermal pads.

Trumonytechs’ R&D team has complete expertise, you just need to tell your specific requirements. We help you determine what you need.

According to different application requirements and material property requirements, selecting the best thermal conductive material is the best way to improve the thermal performance of thermal conductive materials.

Trumonytechs develops and manufactures different material types such as thermal pad, thermal gel, thermal grease, thermal conductive structural adhesives, etc. to meet different specific applications.

Material compatibility is one of the most overlooked factors because in extreme environments, interface materials can be severely affected, affecting component life.

For example, exposuring to silicon vapor can easily damage the substrate. This means that you must choose a silicone TIM. Therefore, when selecting materials, you must inform us of the detailed application environment.

Common Application of TIM

Trumonytechs provides professional thermal solutions for many industries, and the thermal interface material is the most important thermal conduction part. The main function is to fill the gap between the two contact interfaces, act as a thermal interface, and improve the heat dissipation performance. Common industries are


Thermal conductive interface materials are used between aluminium substrates and heat sink fins, between aluminium substrates and lamp housings.


between computer graphics cards and heat sinks, between cooling devices and chassis or frames.


potting of solar photovoltaic inverters; between battery packs and water-cooled versions; interface between MOS tubes, transformers and heat sinks or housings.


Thermal conduction between motherboard ICs and heatsinks or housings for TD-CDMA products; thermal conduction between DC-DC ICs and housings for set-top boxes


Trumonytechs offers a complete range of battery pack solutions. These include square and cylindrical battery packs.


applications in automotive electronics (e.g. xenon lamp ballasts, audio, screens, radar lamp car series products)

Advantages of Trumonytechs Thermal Interface Materials

Trumonytechs mainly develops and manufactures silicone thermal conductive materials, auxiliary polyurethane and epoxy resin systems. Highly thermal stability and resistance to other harsh environments. And Trumonytechs also has a complete interface material research and development team. We rely on the scientific research team of Shanghai Jiaotong University to continuously explore and improve thermal interface materials. Aims to provide professional thermal interface materials to global customers. A complete portfolio of packaging and Assembly material for various industries.